The 8th Edition of Business of Intellectual Property Asia Forum (BIP Asia) (Supported by CMA)
| Date: 2018/12/06 - 2018/12/07 |
| Venue: Hong Kong Convention& Exhibition |
| Language : Eng( PTH interpret) |
| Fee : CMA Member: $720 each (Two-day pass + Keynote Luncheon on 6/12) |
| Contact Person : Ms Ivy Leung Tel : 2584 4013 |
| Email : ivy.leung@hktdc.org |
The captioned is jointly organized by the HKSAR Government, Hong Kong Trade Development Council and Hong Kong Design Centre, supported by CMA. Themed as “IP & Innovation in the New Socio-technological Landscape”, the forum will bring IP professionals and business leaders from around the world to discuss the latest developments in IP and explore business collaboration opportunities. The Forum last year attracted more than 2,500 IP professionals and industry leaders, featuring over 80 prominent speakers sharing their insights. For more details and registration, please access the following website: http://www.cma.org.hk/uploads/ckfinder/files/Event/Seminars/BIPeDM_ENG.pdf
For the exhibition details and registration, please access the following websites:
http://www.cma.org.hk/uploads/ckfinder/files/Event/Seminars/3a%20BIP2018_Exhibition%20Package%20(HKD%20Version)_SO.pdf and http://www.cma.org.hk/uploads/ckfinder/files/Event/Seminars/3b%20Application%20Form%20(2018%20BIP%20Exhibition%20Hall)_SO.pdf
(Application form)